Motherboard
- 8 layer
- Space/Trace: 4/4mil
- High Tg FR-4
- Via in pad, resin plug
- Size: 30″ x 6″
- Hole size: 8mil
High Layer Handheld
- 12 layer
- High Tg FR-4
- Impedance Ctrl
- Space/Trace: 4/4mil
- Hole size: 8mil
- Finish: 3u” ENIG
Large Panel
- 8 layer
- High Tg FR-4
- Size: 30″ x 6″
- Space/Trace: 4/4mil
- Via in pad, resin plug
- Hole size: 8mil
HDI
- 6 layer
- High Tg FR-4
- HDI (2+)
- Space/Trace: 3/3mil
- Via in pad, resin plug
- Hole size: 4mil
Rigid-Flex
- Rigid 4L + Flex 2L
- High Tg FR-4
- Cu Thickness: 1 oz
- Space/Trace: 3/3mil
- Hole size: 12mil
- Finish: ENIG
Flex PCB
- 3 layer
- Polyimide
- Thickness: 4mil
- Space/Trace: 4/4mil
- Gold Finger: 30u”
- Finish: LF-HASL
High Performance
- 4 layer
- Nelco N4000
- Thickness: 245mil
- Counter sink PTH
- Aspect Ratio: 10:1
- Finish: Gold plating
RF / Ceramic
- 4 layer
- Rogers RO4350
- Thickness: 40mil
- Space/Trace: 6/6mil
- Hole size: 8mil
- Finish: Gold Plating
Hole Density
- 6 layer
- 150 Tg FR-4
- Cu Thickness: 2 oz
- Space/Trace: 5/5mil
- Holes: 51,096 sq/ft
- Finish: LF-HASL
Gold Finger
- 2 layer
- 130 Tg FR-4
- Cu Thickness: 2 oz
- Hole size: 10 mil
- Gold Finger: 30u”
- Finish: LF-HASL
Metal Core
- 1 layer
- Bergquist HT-07006
- Cu Thickness: 1 oz
- IPC Class: III
- Thickness: 38mil
- Finish: Immersion Tin
Low Cost
- 1 layer
- CEM-1
- Thickness: 62mil
- Profile: Punch
- Finish: OSP
- Application: Consumer
Laminate Materials
Solder Mask
Surface Finishes
Lead Times
